SOLDER REELS
Soldering Solutions
| Part | Description | Size | Rod Thickness |
|---|---|---|---|
| SOL-L3.0 | 3.0MM SOLDER 500G LEADED | 500g | 3.0MM |
| SOL-LF3.0 | 3.0MM SOLDER 500G LEAD-FREE | 500g | 3.0MM |
Lawton Plumbing Solder
Lawton Plumbing Solder is a high-quality solder wire designed for reliable jointing of copper plumbing systems. Available in both lead and lead-free versions, it provides consistent performance when used with Lawton copper tubes and end-feed fittings.
Manufactured to EN ISO 9453 standards, Lawton Plumbing Solder is suitable for professional plumbing and heating applications, helping installers achieve strong, dependable soldered joints across a wide range of installations.
Supplied in convenient 500g reels, it is ideal for domestic, commercial and industrial pipework applications where quality and reliability are essential.
Key Features
-
- Available in lead and lead-free versions
- Manufactured to EN ISO 9453 standards
- Designed for copper tube and end-feed fitting applications
- Provides strong and reliable soldered joints
- Suitable for plumbing and heating installations
- Supplied in 500g reels
- Ideal for professional trade use
Technical Data
Product Overview
| Property | Specification |
|---|---|
| Product Name | Lawton Jointing Solutions |
| Product Range | Brazing Rods, Solder Wire and Fluxes |
| Applications | Capillary brazing and soft soldering of copper and copper alloy pipework |
| Market Segment | Plumbing, HVAC/R, Medical, Engineering |
| Product Families | Copper-phosphorus brazing rods (0-15% Ag), silver brazing rods (30-56% Ag), leaded and lead-free solder wire, soldering and brazing fluxes |
| Brazing Rod Standard | BS EN ISO 17672:2024 |
| Solder Wire Standard | BS EN ISO 9453 |
| Designation Standard | BS EN ISO 3677 |
| Cadmium Content | All brazing alloys cadmium-free (Cd ≤ 0.010%) |
| Form of Supply | Rods, solder wire reels and flux containers |
| Pack Sizes | 1kg packs, 5-rod packs, 500g reels |
| Test Certificates | EN 10204 3.1 Available |
| Safety Documentation | SDS Available on Request |
| Warranty | 2 Years |
CuP Rod Range
| Attribute | S2 / CuP179 | S2 (0.2) | AG2P | AG5P | AG6P | AG15P |
|---|---|---|---|---|---|---|
| Product Name | 0% Silver Brazing Alloy | 0.2% Silver Brazing Alloy | 2% Silver Brazing Alloy | 5% Silver Brazing Alloy | 6% Silver Brazing Alloy | 15% Silver Brazing Alloy |
| EN ISO 17672 Designation | CuP179 | Proprietary | CuP279 | CuP281 | CuP283 | CuP284 |
| EN ISO 3677 Designation | B-Cu94P-710/890 | — | B-Cu92PAg-645/825 | B-Cu89PAg-645/815 | B-Cu87PAg-643/720 | B-Cu80AgP-645/800 |
| Type | Copper-Phosphorus Brazing Alloy | Copper-Phosphorus Brazing Alloy | Copper-Phosphorus-Silver Brazing Alloy | Copper-Phosphorus-Silver Brazing Alloy | Copper-Phosphorus-Silver Brazing Alloy | Copper-Phosphorus-Silver Brazing Alloy |
| Application | HVAC/R & Plumbing Copper-to-Copper | HVAC/R & Plumbing Copper-to-Copper | HVAC/R Copper-to-Copper, Improved Ductility | HVAC/R, Medical & Plumbing, Good Gap Filling | HVAC/R, Reduced Heat Input | HVAC/R & Medical, Highest Ductility |
| Solidus (°C) | 710 | 710 | 645 | 645 | 645 | 645 |
| Liquidus (°C) | 890 | 890 | 825 | 815 | 720 | 800 |
| Working Temperature (°C) | 760 | 760 | 740 | 710 | 690 | 700 |
| Density (g/cm³) | 8.1 | 8.1 | 8.1 | 8.2 | 8.1 | 8.3 |
| Tensile Strength (N/mm²) | 490 | 490 | 490 | 600 | 600 | 600 |
| Hardness (HV) | 195 | 195 | 195 | 190 | 200 | 180 |
| Elongation (%) | 5 | 5 | 5 | 7 | 3 | 10 |
| Electrical Conductivity (% IACS) | 8.5 | 8.5 | 9 | 10 | 8 | 11 |
| Flux on Copper-to-Copper | Not Required | Not Required | Not Required | Not Required | Not Required | Not Required |
| Flux on Brass/Bronze | Required | Required | Required | Required | Required | Required |
CuP Rod Composition
| Lawton Name | Cu (%) | P Min (%) | P Max (%) | Ag Min (%) | Ag Max (%) |
|---|---|---|---|---|---|
| S2 / CuP179 | Remainder | 5.9 | 6.5 | — | — |
| S2 (0.2) | Remainder | 6.0 (typ.) | 6.8 (typ.) | 0.1 (typ.) | 0.34 (typ.) |
| AG2P | Remainder | 5.9 | 6.7 | 1.5 | 2.5 |
| AG5P | Remainder | 5.8 | 6.2 | 4.8 | 5.2 |
| AG6P | Remainder | 7.0 | 7.5 | 5.8 | 6.2 |
| AG15P | Remainder | 4.8 | 5.2 | 14.5 | 15.5 |
CuP Alloy Impurity Limits
| Element | Maximum (%) |
|---|---|
| Aluminium (Al) | 0.01 |
| Bismuth (Bi) | 0.030 |
| Cadmium (Cd) | 0.010 |
| Lead (Pb) | 0.025 |
| Zinc (Zn) | 0.05 |
| Zinc + Cadmium | 0.05 |
| Total Impurities | 0.25 |
FAQ
Your questions,
Answered.
Lead Free Solder Wire Data
Leaded Solder Wire Data