SOLDERING FLUX PASTE
Soldering Solutions
| Part | Description | Size |
|---|---|---|
| SOL-FLF113 | SOLDER FLUX 113G (4 OZ) WITH BRUSH | 113g |
| SOL-FLF453 | SOLDER FLUX 453G (16 OZ) | 453g |
Lawton Soldering Flux Paste
Lawton Soldering Flux is a high-quality, water-soluble paste flux designed for use with copper plumbing fittings and tubes. Suitable for soft soldering applications, it helps create reliable soldered joints between copper and tin-based solder alloys.
Manufactured to EN ISO 9454 (2.1.2.C) standards, Lawton Soldering Flux provides consistent performance for professional plumbing and heating installations. Supplied in convenient 113g (4oz) and 453g (16oz) plastic jars, each supplied with a complimentary application brush for accurate and controlled use.
Ideal for use across domestic, commercial and industrial plumbing applications, Lawton Soldering Flux offers dependable joint preparation and ease of application for installers.
Key Features
- High-quality paste flux for soft soldering applications
- Suitable for copper plumbing fittings and tubes
- Designed for copper-to-tin alloy soldering
- Water-soluble formulation for easy cleaning
- Complies with EN ISO 9454 (2.1.2.C)
- Supplied with complimentary application brush
- Available in 113g (4oz) and 453g (16oz) jars
- Suitable for professional plumbing and heating installations
Technical Information
- Product Type: Soft solder flux paste
- Appearance: Yellowish paste
- Physical State: Paste at 20°C
- Odour: None
- pH: 6–7
- Density: 1.10 g/cc
- Water Solubility: Total
- Freezing Point: -10°C
- Heat Stability: Stable emulsion up to 65°C; active up to 300°C
Chemical Composition
- 20% Ethoxylated fatty alcohol
- 5% Fatty acid
- 50% Amine chloride
- 25% Water
Safety Information
Lawton Soldering Flux is not classified as dangerous under European Directive criteria for the control of hazardous substances. When used correctly, it presents no significant risk to health or the environment.
Avoid prolonged skin contact and direct inhalation of vapours during heating. The use of the supplied application brush and appropriate protective equipment is recommended when required.
Technical Data
Product Overview
| Property | Specification |
|---|---|
| Product Name | Lawton Jointing Solutions |
| Product Range | Brazing Rods, Solder Wire and Fluxes |
| Applications | Capillary brazing and soft soldering of copper and copper alloy pipework |
| Market Segment | Plumbing, HVAC/R, Medical, Engineering |
| Product Families | Copper-phosphorus brazing rods (0-15% Ag), silver brazing rods (30-56% Ag), leaded and lead-free solder wire, soldering and brazing fluxes |
| Brazing Rod Standard | BS EN ISO 17672:2024 |
| Solder Wire Standard | BS EN ISO 9453 |
| Designation Standard | BS EN ISO 3677 |
| Cadmium Content | All brazing alloys cadmium-free (Cd ≤ 0.010%) |
| Form of Supply | Rods, solder wire reels and flux containers |
| Pack Sizes | 1kg packs, 5-rod packs, 500g reels |
| Test Certificates | EN 10204 3.1 Available |
| Safety Documentation | SDS Available on Request |
| Warranty | 2 Years |
CuP Rod Range
| Attribute | S2 / CuP179 | S2 (0.2) | AG2P | AG5P | AG6P | AG15P |
|---|---|---|---|---|---|---|
| Product Name | 0% Silver Brazing Alloy | 0.2% Silver Brazing Alloy | 2% Silver Brazing Alloy | 5% Silver Brazing Alloy | 6% Silver Brazing Alloy | 15% Silver Brazing Alloy |
| EN ISO 17672 Designation | CuP179 | Proprietary | CuP279 | CuP281 | CuP283 | CuP284 |
| EN ISO 3677 Designation | B-Cu94P-710/890 | — | B-Cu92PAg-645/825 | B-Cu89PAg-645/815 | B-Cu87PAg-643/720 | B-Cu80AgP-645/800 |
| Type | Copper-Phosphorus Brazing Alloy | Copper-Phosphorus Brazing Alloy | Copper-Phosphorus-Silver Brazing Alloy | Copper-Phosphorus-Silver Brazing Alloy | Copper-Phosphorus-Silver Brazing Alloy | Copper-Phosphorus-Silver Brazing Alloy |
| Application | HVAC/R & Plumbing Copper-to-Copper | HVAC/R & Plumbing Copper-to-Copper | HVAC/R Copper-to-Copper, Improved Ductility | HVAC/R, Medical & Plumbing, Good Gap Filling | HVAC/R, Reduced Heat Input | HVAC/R & Medical, Highest Ductility |
| Solidus (°C) | 710 | 710 | 645 | 645 | 645 | 645 |
| Liquidus (°C) | 890 | 890 | 825 | 815 | 720 | 800 |
| Working Temperature (°C) | 760 | 760 | 740 | 710 | 690 | 700 |
| Density (g/cm³) | 8.1 | 8.1 | 8.1 | 8.2 | 8.1 | 8.3 |
| Tensile Strength (N/mm²) | 490 | 490 | 490 | 600 | 600 | 600 |
| Hardness (HV) | 195 | 195 | 195 | 190 | 200 | 180 |
| Elongation (%) | 5 | 5 | 5 | 7 | 3 | 10 |
| Electrical Conductivity (% IACS) | 8.5 | 8.5 | 9 | 10 | 8 | 11 |
| Flux on Copper-to-Copper | Not Required | Not Required | Not Required | Not Required | Not Required | Not Required |
| Flux on Brass/Bronze | Required | Required | Required | Required | Required | Required |
CuP Rod Composition
| Lawton Name | Cu (%) | P Min (%) | P Max (%) | Ag Min (%) | Ag Max (%) |
|---|---|---|---|---|---|
| S2 / CuP179 | Remainder | 5.9 | 6.5 | — | — |
| S2 (0.2) | Remainder | 6.0 (typ.) | 6.8 (typ.) | 0.1 (typ.) | 0.34 (typ.) |
| AG2P | Remainder | 5.9 | 6.7 | 1.5 | 2.5 |
| AG5P | Remainder | 5.8 | 6.2 | 4.8 | 5.2 |
| AG6P | Remainder | 7.0 | 7.5 | 5.8 | 6.2 |
| AG15P | Remainder | 4.8 | 5.2 | 14.5 | 15.5 |
CuP Alloy Impurity Limits
| Element | Maximum (%) |
|---|---|
| Aluminium (Al) | 0.01 |
| Bismuth (Bi) | 0.030 |
| Cadmium (Cd) | 0.010 |
| Lead (Pb) | 0.025 |
| Zinc (Zn) | 0.05 |
| Zinc + Cadmium | 0.05 |
| Total Impurities | 0.25 |
